Technical Data Sheet (TDS)

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THERMOGRIP 443

Versatile hot melt adhesive adhesive for difficult cardboard. 

Uses

THERMOGRIP 443 is a 100% hot melt adhesive for case sealing applications. Specially adapted for difficult substrates* such as moisture-treated substrates with stringy effect (double or triple fluted). Suitable for middle- and high-speed packaging lines.

* Not suitable for varnished cardboard.

Benefits

  • Suitable for moisture-treated substrates with stringy effect (double or triple fluted)
  • All ingredients are approved under the Federal regulation 175 105 & BGA (for incidental contact of adhesives with food)
  • Good thermal stability
  • Good hot tack
  • Long open time
  • Good resistance to low and high temperatures
  • Suitable for all applications by nozzle (Nordson, Valco, Robatech, etc.)
  • Suitable for application by wheel (never exceed 180°C)

Properties

Physical:

  • Aspect: pellets
  • Colour: white
  • Thermosel Viscosity– spindle 21, 20 rpm at 170°C: 800 – 1400 mPas
  • Softening point, Ring & Ball: approx. 106-113°C
  • Open time*: < 1 second
  • Setting time*: approx. 1 to 5 seconds

 
* Open and setting times are tested according to Bostik internal method. Open and setting times may vary depending on:

  • ambient temperature, temperature of the substrate, adhesive application temperature
  • coverage
  • nature and porosity of the substrate

Shelf life:

2 years in original unopened packaging, stored at ambient temperature. Keep away from humidity.

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Application

Application temperature: 160–180°C. Application by nozzle or wheel (never exceed 180°C).

 

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Packaging

Presentation Bar code Bostik code
bag - 25 kg 068221