ASSEMBLY OF FLOORBOARDS:
PREPARATION
Preparation should be in accordance with building standards. Subfloors must be sound, even, smooth, permanently dry and free from old adhesive residues, dust, grease or other contaminants.
When overlaying existing floor coverings ensure that they are firmly bonded and clean.
Remove dirt, polish, oil and similar contaminating substances.
When further preparation of the subfloor is required, select suitable Bostik primers and Bostik smoothing and levelling compounds.
All surfaces must incorporate adequate damp proofing, if not, they should be primed with Eponal 376 Moisture Vapour Barrier coating.
Always allow primers and underlayment to dry thoroughly before applying the adhesive.
APPLICATION
Cut off the tip of the nozzle at an angle to give the required size of opening. Apply adhesive in a continuous operation into the groove. Then close up the strips or planks together within the working time (approx. 5 minutes) and using a mallet or a hammer and a tapping block. For laminate flooring a small amount of glue should squeeze out of the joint. Immediately wipe off the surplus glue with a damp cloth.
Allow a gap for expansion joint along the perimeter of the floor. A gap of 5 to 8 mm should be done between the wood flooring and walls. Gap dimensions: 0.15% of the largest dimensions of the area to be covered with flooring. These expansion joints will be later covered by skirting boards.
If kept in a dust environment clean tongues and grooves.
Apply adequate adhesive quantity along the length of the joint(s).
Wipe off spillages, whilst wet, with a damp cloth.
Reducing sound transmission
Sticking together blanket insulation and parquet onto substrates will significantly reduce sound transmission. SUBO EC 20 provides efficient bonding with possibility of later dismantling.
Apply SUBO EC 20 Fixer with a roller (consumption: 100 g/m²) onto the required underlayment. Allow an appropriate waiting time (approx. 45 to 60 minutes). The upper side of the underlay becomes tacky and creates a solid bond between underlayment and laminate planks. The laminate planks can be later disassembled.
REMARKS
- Always follow the manufacturer’s installation instructions.
- Store the wood flooring in a dry place.
- In all cases observe an appropriate drying time.
- Do not apply the adhesive below +8°C.
WOOD ASSEMBLY
PREPARATION
Susbstrates should be dry, clean and tempered.
Wood moisture content should be between 8 and 12%.
APPLICATION
Cut off the tip of the nozzle at an angle to give the required size of opening. Apply adhesive onto substrates and close up within the working time (approx. 5 minutes).
The application on one side is generally sufficient but 2 side application is required on porous substrates or if the outside temperature is above +20°C.
Observe closed assembly time of 1 to 2 minutes before putting assembled materials under press. Maintain assembled materials under press during the whole press time (see above for required pressing time).
Required pressure is 5 to 7 kg/cm².
Immediately wipe off the surplus glue with a damp cloth.
Note that the temperature of the adhesive, ambient temperature and substrate temperature may influence significantly the recommended times. The most suitable temperature is between +18 and +25°C
CLEANING
Tools and spillages are cleaned easily with water.
Insulating Glass
Environmentally friendly
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